Heller Industries 1706EXL Reflow Oven | for Clean Room Class 10,000 and 1,000 Environments | 6 Heat Zones / 1 Cool
For Resellers and High Volume Orders: Please request a quote to obtain preferred pricing.
Introduction
Designed for Cleanroom Class 10,000 and 1,000 environments, these high precision system utilize the shortest available footprint, provide ultra-low PPM nitrogen levels and are perfectly suited for Wafer Bump, BGA Balling and flip Chip applications.
Features
350°C Operating Temperatures - Standard
400°C and 450°C Options
5 T/C Profiling with KIC or ECD software - Standard
Advanced Windows Operating system with Data Logging, Alarm Logging and GEM/Secs Host
Calendar Startup - Standard
Computer interfacing option
Dual Edge Hold Conveyor option
Edge Hold Conveyor / Mesh Belt option
GEN 6 Filterless / Waterless Cooling option
Lead-Free processing capability
Lifetime Warranty on Heaters and Blowers
Nitrogen Option with < 1000 SCFH@40PPM
Nitrogen Retrofit option
Pure Forced Convection Heating
RMATS — Remote Monitoring and Technical Support option